| 摘要 |
A method for attaching an adhesive tape to a semiconductor wafer is provided to prevent a semiconductor wafer from being warped in a handling process by reinforcing a semiconductor wafer by an annular convex part formed in the outer circumference of the back surface of the wafer. An annular convex part is formed on the outer circumference of the back surface of a semiconductor wafer(W) to surround a backgrind region, and a retain table(6) is closely attached to the overall circumference of the annular convex part. Fluid is supplied from the retain table to a space between the back surface of the semiconductor wafer and the retain table to increase the inner pressure of the space. An adhesive tape for peeling is supplied to the surface of a protection tape attached to the semiconductor wafer. While the non-adhesive surface of the adhesive tape is pressurized to an attach member broader than the outer diameter of the semiconductor wafer, the attach member is transferred from one end of the semiconductor wafer to the other end of the wafer and the adhesive tape is attached to the surface of the protection tape. A concave part is formed in the retain table and connects with a ground flat concave part formed on the back surface of the wafer. The annular convex part is absorbed to the outer circumference of the concave part. |
