| 摘要 |
A bonding apparatus is provided to perform an effective surface treatment on a bonding target by micro plasma by continuously performing a bonding treatment and a surface treatment on the same bonding target. A bonding process part performs a bonding treatment on a bonding target by using a bonding tool. A plasma capillary(40) includes plasma generating part and a sealing gas injecting part. The plasma generating part injects plasma gas from an opening formed at its front end to the bonding target. The sealing gas injecting part injects sealing gas from an opening of a coaxially attached ring-type flow end part to the outer surface of the plasma generating part and seals the plasma gas from the external air. The plasma generating part can include a box-type member made of an insulator, a coaxially attached cylindrical outer electrode(56), and a capacitively coupled micro plasma generating part injects the plasma gas in the box-type member through an opening of the front end of the box-type member by a power supply to a linear inner electrode(54) attached to a central axis of the box member. |
