| 摘要 |
#CMT# #/CMT# Production of an information carrier, comprising a male connector (10), a microcircuit (4) attached to the connector and an outer casing for the microcircuit, includes the stage of forming a first monoblock part with the outer casing by molding, leaving the connector free but covering the microcircuit. #CMT# : #/CMT# An independent claim is included for an information carrier as above, including the first monoblock part. #CMT#USE : #/CMT# The product is typically a USB key. #CMT#ADVANTAGE : #/CMT# The microcircuit (and preferably also a security element) is/are inaccessible (unless the outer casing is destroyed), but readily detectable by the user. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The figure shows a schematic diagram of a stage in one variant of the process for producing an electronic information card, of the USB key type. 2 : Electronic card 4 : Microcircuit 6 : Open mold 10 : USB male connector 12 : Dosing nozzle 16 : Security element #CMT#POLYMERS : #/CMT# Preferred Process: The process also includes the stage of forming a (preferably transparent) second monoblock part with the outer casing by molding, covering a security element (16) (preferably a visual representation, especially an engraved or printed element, a hologram or a security ink; or an element detectable by an external device, especially a magnetic element). During formation of the second part, the security element is held by a retractable element or (if the second part is formed in a mold) is held in contact with the mold wall using a suction hole. Molding of the second part optionally includes integration of security ink pigments or a perfume. The first and second parts are molded simultaneously; or the second part is overmolded on the first part. Production is carried out in a vertically extending mold. Preferably molding is carried out in contact with an electronic card carrying the microcircuit and having anchoring devices for the first part. Preferred Materials: Molding is preferably carried out by casting a resin without applied pressure (although molding under pressure is also possible). The resin specifically has a viscosity of less than 1000 (especially 30-110) mPa.s and a glass transition temperature of more than 70[deg] C; contains a curing agent; and is polymerizable. In particular a thermosetting resin is used. |
