| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for achieving miniaturization and highly dense wiring, and for forming a solder section whose buildup is high, and for surely mounting semiconductor components, and to provide a circuit board with solder using the above mentioned circuit board and a semiconductor component mounting substrate and a method for manufacturing them. SOLUTION: A land part 3 extended from a leader conductor 2 is configured of a plurality of thin conductor patterns 3a separated to the width direction by a solder non-adhesion section 3b formed between both sides 3d and 3d with fixed width between the both sides 3d and 3d and one wide conductor pattern 3c which is not separated by the solder non-adhesion section 3b in the extended direction. In the case of applying cream solder 8 to the land section 3, and heating and melting it to form a solder part 5, the solder part 5 whose buildup is high is formed by making solder agglomerate in the wide conductor pattern 3c with the surface tension of the melted solder. COPYRIGHT: (C)2008,JPO&INPIT
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