发明名称 METHOD AND APPARATUS FOR DIELECTRIC SURFACE MICRO-MOLDING, DIELECTRIC JOINING METHOD AND DIELECTRIC JOINING APPARATUS
摘要 PROBLEM TO BE SOLVED: To collectively and directly heat the surface layer part of a heating target using an energy transmission technique adaptable to heating in order to achieve not only the use of a wide range of a thermoplastic resin or the like but also the enhancement of the productivity thereof. SOLUTION: When a surface transfer mold 17 is brought into contact with an object 20 to be molded to heat the same and the object 20 to be molded is released after the temperature of the surface transfer mold 17 falls to transfer an uneven shape to the object 20 to be molded, a thermoplastic dielectric is employed in the surface transfer mold 17 and, at the time of heat treatment, the surface transfer mold 17 and the object 20 to be molded are irradiated with a radio wave 8 from the outside to penetrate the irradiated radio wave 8 into the object 20 to be molded to advance the same to the contact surface with the surface transfer mold 17. Further, the surface transfer mold 17 and the object 20 to be molded are irradiated with the radio wave so as to reflect the radio wave from the contact surface of the surface transfer mold 17 to melt the surface layer part 21 of the object 20 to be molded. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008018570(A) 申请公布日期 2008.01.31
申请号 JP20060190656 申请日期 2006.07.11
申请人 NAKANO SEISAKUSHO:KK 发明人 NAKANO KAZUAKI
分类号 B29C59/02;B29C33/42;B29C59/00;B81C99/00;H01L21/027 主分类号 B29C59/02
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