| 摘要 |
A thermal-cycling device for thermally processing at least one substance carried by a thermally-conductive microwell plate includes a heating-cooling unit that may be placed in thermal contact with a surface of the microwell plate. The microwell plate may include at least one well that may have low volume capacity. In one embodiment, the microwell plate is transported by a carrier in the thermal-cycling device and positioned in thermal communication with the heating-cooling unit. The heating-cooling unit may include one or more Peltier units, a heat sink and a heat spreader.
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