| 摘要 |
The flow of polymer formulations in in integrated circuit packages can be controlled by altering the roughness and surface chemistry of package surfaces. The surface roughness can be altered by forming protrusions having a dimension less than 500 nanometers and their chemistry can be controlled by chemical or plasma treatment. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be super-hydrophobic by particles of the same general characteristics.
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