发明名称 Printed Circuit Board With Improved Via Design
摘要 A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.
申请公布号 US2008026602(A1) 申请公布日期 2008.01.31
申请号 US20070868085 申请日期 2007.10.05
申请人 WANG ALAN E;OLSON KEVIN C 发明人 WANG ALAN E.;OLSON KEVIN C.
分类号 H01R12/00;H05K1/05;H05K1/02;H05K3/00;H05K3/44;H05K3/46 主分类号 H01R12/00
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