| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of thinning a wafer so that no dimples are generated. SOLUTION: In the wafer 2, the opening of a through-hole on a non-adhering surface where the wafer of a support plate 1 having a through-hole 10 adhered with an adhesive member 4 is blocked with a dimple prevention member 3 having not less than 100μm thickness. Then, while vacuum suction is being performed to the support plate via the dimple prevention member, the wafer is ground/polished. COPYRIGHT: (C)2008,JPO&INPIT |
