POLISHING COMPOSITION

摘要

Disclosed is a polishing composition which realizes both high planarity and reduction of corrosion in the surface of a wiring metal. Specifically disclosed is a polishing composition containing an oxidizing agent (A), at least one or more acids (B) selected from amino acids, carboxylic acids having 8 or less carbon atoms and inorganic acids, a sulfonic acid (C) having a concentration of not less than 0.01% by mass and an alkyl group having 8 or more carbon atoms, a fatty acid (D) having a concentration of not less than 0.001% by mass and an alkyl group having 8 or more carbon atoms, and at least one or more compounds (E) selected from pyridinecarbonyl compounds, nonionic water-soluble polymers, 2-pyrrolidone, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, gramine, adenine, N,N'-diisopropylethylenediamine, N,N'-bis(2-hydroxyethyl)ethylenediamine, N,N'-dibenzylethylenediamine and N,N'-diphenylethylenediamine.