发明名称 |
Verfahren zur Herstellung eines Halbleiterbauelements auf der Basis einer Lead-on-Chip-Architektur, Halbleiterbauelement und Leiterrahmen zur Implementierung in einem Halbleiterbauelement |
摘要 |
A leadframe includes a multiplicity of leads. The leads have a board level contact portion, an intermediate portion and a chip level contact portion. The intermediate portion is disposed between the board level contact portion and the chip level contact portion. The board level contact portions extend from one of the first side or the second side of the semiconductor device along a second direction. The chip level contact portions extend along the first direction. Ends of the chip level contact portions are aligned along a line extending along the second direction. This leadframe can be included with a semiconductor chip in a packaged integrated circuit. |
申请公布号 |
DE102005044331(B4) |
申请公布日期 |
2008.01.31 |
申请号 |
DE20051044331 |
申请日期 |
2005.09.16 |
申请人 |
INFINEON TECHNOLOGIES FLASH GMBH & CO. KG |
发明人 |
DOSSI, ROBERTO |
分类号 |
H01L23/50;H01L21/60;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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