| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component packaging head capable of reducing the size of a device and costs, and to provide a filter unit. <P>SOLUTION: In the component packaging head for holding an electronic component by vacuum suction using a suction nozzle 12 for packaging onto a substrate, a nozzle holder for holding the suction nozzle 12 is connected to a head body for supporting the nozzle holder vertically and freely movably by a filter unit 15, where a filter ball 28 manufactured by a porous body is inserted into a flexible tube 27. In this case, the filter ball 28 is set to be in a shape, where there are no edges for generating a flexure in the tube 27 in the bending deformation of the tube 27. As a result, the fitting space of a filter component is miniaturized for reducing the size of the device, and an inexpensive material having a simple configuration is used for reducing costs. <P>COPYRIGHT: (C)2008,JPO&INPIT |
