A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.
申请公布号
WO2007118133(A3)
申请公布日期
2008.01.31
申请号
WO2007US66034
申请日期
2007.04.05
申请人
MEDTRONIC, INC.;BURDON, JEREMY W.;YAMAMOTO, JOYCE K.;NYGREN, LEA A.;WOLF, WILLIAM D.
发明人
BURDON, JEREMY W.;YAMAMOTO, JOYCE K.;NYGREN, LEA A.;WOLF, WILLIAM D.