Pressure sensor, has semiconductor chips corresponding to strain measuring devices, where each strain measuring device is arranged in semiconductor chip, respectively, and each semiconductor chip is attached to diaphragm

摘要

The pressure sensor (100) has a metallic diaphragm (20) for receiving pressure, and strain measuring devices forming a Wheatstone bridge. Each strain measuring device outputs an electrical signal, which corresponds to a deformation of the diaphragm, if the diaphragm is deformed by the pressure. Semiconductor chips (21b, 21c) correspond to the strain measuring devices, where each strain measuring device is arranged in the semiconductor chip, respectively. Each semiconductor chip is attached to the diaphragm. An independent claim is also included for a method for manufacturing a pressure sensor.