| 摘要 |
To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21 A arranged on its surface; and a first semiconductor element 11 A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10 , wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11 A (i.e., at least one of the electrodes 21 and 22 ), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.
|
