| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus which can efficiently form pore holes to arrive at a bonding pad without generating metal contamination. <P>SOLUTION: The laser beam machining apparatus comprises a chuck table for holding a workpiece, a laser beam radiating means for irradiating the workpiece held by the chuck table with a laser beam, a machining feeding means for relatively feeding the chuck table and the laser beam radiating means in machining, and an indexing feeding means for indexing the chuck table and the laser beam radiating means in the direction perpendicular to the machining feed direction. The laser beam radiating means comprises a first laser beam radiating means for radiating a first pulse laser beam having an energy density of 20 to 60 J/cm<SP>2</SP>per one pulse, and a second laser beam radiating means for radiating a second pulse laser beam having an energy density of 3 to 20 J/cm<SP>2</SP>per one pulse. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
