发明名称 |
Raised Solder-Mask-Defined (SMD) Solder Ball Pads For a Laminate Electronic Circuit Board |
摘要 |
A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.
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申请公布号 |
US2008023834(A1) |
申请公布日期 |
2008.01.31 |
申请号 |
US20070867527 |
申请日期 |
2007.10.04 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
CHIU TZ-CHENG;VARIYAM MANJULA N. |
分类号 |
H01L23/488;G03F7/00;H05K1/11;H05K3/34;H05K3/40 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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