SILICON LED PACKAGE HAVING HORN AND CONTACT EDGE WITH (111) PLANES

摘要

A silicon LED(Light Emitting Diode) package having a horn and a contact edge with (111) planes are provided to improve reliability of an electrode wiring and simplify a manufacturing process. A silicon LED package includes a silicon substrate(1), a concave horn(2), at least one through hole or one contact edge(3), and at least one LED chip. The silicon substrate has a surface and a rear surface. The concave horn is formed from the surface to a middle of the silicon substrate and has a bottom surface of (100) planes and four slant side walls of (111) planes. The one through hole or one contact edge is formed outside the concave horn by passing through the silicon substrate, is extended from the surface and the rear surface of the silicon substrate, and has a slant side wall composed of the (111) planes in contact with the silicon substrate at a middle height. The one LED chip is mounted on a bottom surface of the concave horn.