| 摘要 |
A bonding apparatus capable of efficiently performing surface treatment using microplasma and a bonding process to an object to be bonded including a plasma capillary having a tubular plasma capillary main body made of an insulating body, a cylindrical external electrode provided outside the tubular plasma capillary main body, a linear internal electrode provided at the center of the inside of the tubular plasma capillary main body, and a seal gas nozzle provided at the outer circumference of the tubular plasma capillary main body. Microplasma produced within the plasma capillary is sprayed from the main body opening, and performs the surface treatment to a bonding pad while being sealed from an ambient air by a seal gas flow sprayed from the annular opening. In conjunction with the surface treatment, bonding is performed using a bonding capillary.
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