发明名称 |
Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device |
摘要 |
A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.
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申请公布号 |
US2008024991(A1) |
申请公布日期 |
2008.01.31 |
申请号 |
US20060460334 |
申请日期 |
2006.07.27 |
申请人 |
COLBERT JOHN L;CORBIN JOHN S;EAGLE JASON R;HAMILTON ROGER DUANE;MIKHAIL AMANDA E;SINHA ARVIND K;SOBOTTA TERRY L |
发明人 |
COLBERT JOHN L.;CORBIN JOHN S.;EAGLE JASON R.;HAMILTON ROGER DUANE;MIKHAIL AMANDA E.;SINHA ARVIND K.;SOBOTTA TERRY L. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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