ANCHOR SUBSTRATE FOR INCREASING BALL BONDING STRENGTH, AND METHOD FOR BONDING WIRE USING THE SAME

摘要

An anchor member and a wire bonding method using the same are provided to lock a ball shape in a first locking hole of a first anchor member by forming a structure of an outer periphery of a bonding pad using a protective film as an anchor structure. A first anchor member(14a) having a first locking hole(12a) is attached to an upper surface of a semiconductor chip(10), and a wire is ball-bonded to a bonding pad(16) of the semiconductor chip which is exposed through the first locking hole, so that a ball shape is locked in the first locking hole of the first anchor member at ball bonding. An inner periphery of the locking hole is etched to have an arch or straight shape. A second anchor member(14b) having a second locking hole(12b) is attached to the upper surface of the first anchor member.