| 摘要 |
<p>A substrate transfer apparatus for transferring a substrate on which electronic parts are mounted, inexpensively and reliably while preventing any of the electronic parts from coming off and the substrate from being damaged. The substrate transfer apparatus 10 is equipped with an arm body 11 which can move vertically and transversely. To the arm body 11, there are attached a plurality of glass substrate suction pads 12 for vacuum-chucking and supporting the upper face of a glass substrate 21, and a plurality of electronic part suction pads 13 arranged above the electronic parts 22 in positions corresponding to those of the electronic parts and adapted to vacuum-chuck and support the upper faces of the electronic parts 22. Each of the suction pads 12, 13 is connected to a vacuum source through a suction line. Each suction pad 12, 13 is equipped with an adjusting mechanism for adjusting its position relative to the arm body 11, so that its mount position on the arm body 11 can be adjusted in accordance with the size and position of the glass substrate 21 or the electronic parts 22. Each suction pad 13 is equipped with a spring 15 for absorbing an impact which is applied to the electronic part 22 when the suction pad 13 contacts with the electronic part 22.</p> |
