| 摘要 |
A spin head, and an apparatus and a method of treating a substrate having the same are provided to uniformly treat the whole surface of a wafer, and to minimize the process error generated on the contact surface of the wafer. A spin head includes a plate(10), first chucking pins and second chucking pins(22a,32a), a driving cam and an ascending/descending member. The plate is rotatable during a process. The first and second chucking pins are installed on the upper surface of the plate, and support the side of a substrate to prevent the substrate loaded on the plate from being separated from the plate. The driving cam moves the first and second chucking pins towards the radius of the plate by ascending and descending to contact or not to contact the first and second chucking pins with the side of the substrate. The ascending/descending member ascends and descends the driving cam.
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