| 摘要 |
An elastic wave device and a manufacturing method thereof are provided to form a dual filter by adhering and integrating the side of a wafer level packaged single filter. An elastic wave device is formed by charging the gap between at least two elastic surface wave devices with resin. The surface acoustic wave device includes a substrate, a functional part, a package(2), a recess, and a cutout. The functional part is formed on the surface of the substrate. The recess forms a space for the operation of the functional part. The package covers the surface of the substrate. The cutout is placed on the side of each package of the surface acoustic wave device which corresponds to the part connected by the charging of the resin between the surface acoustic wave devices. A part of the side, the rear, and the front of the two elastic surface wave devices is covered by the first resin charged in more than one cutout of the side of the package.
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