| 摘要 |
A method for manufacturing a probe assembly is provided to improve the flatness of a probe and the precision of alignment by firmly bonding a bump portion of the probe to a circuit board through wetness of a solder paste. Plural probes each having a beam portion of a bar type and a bump portion and a tip portion bent from the beam portion are prepared. A circuit substrate(10) with plural seed layers(13) are prepared, and then a base layer(20) with an exposed hole(21) is formed on the circuit substrate. Mask layers(30,40) are applied on the base layer, and then are exposed and developed through a mask(45) to form a receiving hole(31) communicated with the exposed hole and a seating surface(41) adjacent to the receiving hole. A conductive adhesive is introduced into the exposed hole, and then the bump portion is inserted into the conductive adhesive. The mask layer is removed.
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