| 摘要 |
PROBLEM TO BE SOLVED: To inspect a solid-state image sensor chip having a back side bonded to a package from the back side. SOLUTION: A CCD 10 is mounted on a fixing plate 46, a high-power laser beam is irradiated to the CCD 10 while a region accommodating the solid-state image sensor chip 12 is shielded from light, and the package 14 is opened by releasing the bonding of a case 16 and a transparent cover 18. Then, the case 16 and solid-state image sensor chip 12 are fixed by arms 56 to 60. Next, the case 16 is exposed by polishing the fixing plate 46 from the back side of the CCD 10 with a polishing device 55, and afterwards the case 16 is further polished from the back side, thus exposing the solid-state image sensor chip 12. The CCD 10 is driven in such a state, and an extremely faint light emitted by the solid-state image sensor chip 12 is observed from the back side of the CCD 10, thus detecting defective places of the solid-state image sensor chip 12. COPYRIGHT: (C)2008,JPO&INPIT
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