SUBSTRATE TREATMENT METHOD AND FILM FORMING METHOD, FILM FORMING APPARATUS, AND COMPUTER PROGRAM

摘要

There is provided a substrate treatment method performed on a substrate before forming a Cu film on a surface of a base material of the substrate. In the substrate treatment method, a substrate on which a Cu film is to be formed is prepared; and a specific treatment is performed on the substrate so that a crystalline orientation of the surface of the base material of the substrate has a small lattice mismatch with the Cu film.