| 摘要 |
PROBLEM TO BE SOLVED: To perform inspection of a semiconductor device for high-frequency, high-speed use with high accuracy, without damaging electrodes or the electric circuit parts of a semiconductor device which is not to be measured. SOLUTION: When high-frequency characteristics inspection of a semiconductor device for high-frequency, high-speed use is performed with high precision, by using the frame prober method by forming an opening part 603 in an inspection substrate 101 and installing an electronic component 104 in the opening part 603 to be directly connected to a conductive electrode 605 of a conductive sheet connector 601, even if the electronic component 104, such as a capacitor, is installed in the inspection substrate 101, the line length of a transmission path remains short, matching can be made, and there is no interference with a semiconductor device, which is not to be measured, in the vicinity of a semiconductor device to be measured, thereby preventing the electrodes and electric circuit parts of the semiconductor device from being damaged and allowing the high-frequency characteristics inspection of a semiconductor device for high-frequency, high-speed use, with high accuracy. COPYRIGHT: (C)2008,JPO&INPIT
|
