MULTILAYER PRINTED CIRCUIT BOARD

摘要

A ground via, which is arranged at a board end portion of a multilayer printed circuit board for suppressing magnetic field leakage from the board end portion, has such a problem that it does not permit high integration digital circuit mounting, due to requirement of an arrangement area. There is also such a problem that in the case of using solder plating at the board end portion, an extra manufacturing process is required and the number of days and cost are increased. In the multilayer printed circuit board, which has a plurality of ground layers and at least one signal layer, a signal layer wherein a signal pattern is wired at the board end portion is sandwiched between the vertically adjacent ground layers, and the upper and the lower ground layers are connected at the board end portion with a conductive body having a recessed shape. An interval between the conductive bodies is ?/8 of a higher harmonic frequency of an operation frequency or less.