| 摘要 |
PROBLEM TO BE SOLVED: To provide an inorganic filler-containing resin composition enabling a semiconductor element and a substrate to be joined to each other owing to the semiconductor element's own weight even in case of being used as a nonflow-type underfilling material. SOLUTION: The resin composition, to be used for sealing up a semiconductor element and a substrate together, comprises a first epoxy resin liquid at room temperature, a second epoxy resin higher in cure-starting temperature than the first epoxy resin, a silicone-modified epoxy resin and an inorganic filler. A sealing material comprising this resin composition is provided. A semiconductor device is also provided, being such that a semiconductor element and a substrate are sealed up together via the sealing material. COPYRIGHT: (C)2008,JPO&INPIT
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