| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper coating polyimide substrate or a two-layer plating substrate, capable of developing high temperature stability provided originally by a polyimide film without receiving any affection due to the characteristics of an adhesive layer and, at the same time, capable of preparing the thickness of a copper conductor layer so as to be thin and freely, while being excellent in durability against bending upon being used at the bending part. SOLUTION: In the copper coating polyimide substrate constituted by forming a metal sheet layer directly on at least one side of the polyimide film without employing adhesive agent and, further, laminating a copper conductor layer thereon through plating method, the polyimide film is formed of polyimide resin manufactured by the polymerization of biphenyl tetrapod carboxylic acid constituent and phenylenediamine constituent. COPYRIGHT: (C)2008,JPO&INPIT
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