PACKAGE HAVING A PLURALITY OF MOUNTING ORIENTATIONS
摘要
A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
申请公布号
WO2008011585(A2)
申请公布日期
2008.01.24
申请号
WO2007US74007
申请日期
2007.07.20
申请人
ANALOG DEVICES, INC.;SPOONER, TIMOTHY, R.;KUAN, NELSON