| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor element stack which retains pressure bonding force stably for a long period of time, by uniformly bonding a plurality of semiconductor chips through pressure bonding. <P>SOLUTION: The semiconductor stack 1 is constituted so that 3 pieces of conductor blocks 5A, 5B are laminated in spaces of insulating frames 2 provided with a space in an insulating board. Then a semiconductor chip 3 with molybdenum sheets attached to both surfaces thereof is pinched between neighbored conductor blocks respectively, and through-holes 8 are provided on the conductor blocks respectively in a direction orthogonal to the direction of pressure bonding. Elastic bodies 7 are arranged on the further outside of conductor blocks positioned on the outside among the conductor blocks, and the elastic bodies are bonded through pressure bonding to the internal circumferential surfaces of spaces of insulating frames to pinch the semiconductor chips between the conductor blocks by the reaction force of the pressure bonding force. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
