| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape-packaged component feeder and a tape-packaged component feeding method suitable to feeding of chip-like electronic components. <P>SOLUTION: The tape-packaged component feeder 10 has a tape forwarding means for intermittently forwarding a carrier tape 11, and a top tape winding means. In the feeder 10, a cutting blade 18a is disposed on a position before the position of peeling the top tape 14 from the carrier tape 11 and different from the thickness dimension of the top tape 14, a plurality of tape pressing means 17 are disposed at a position P1 of peeling the top tape 14, and a component guide 19 is disposed at a position different from the thickness dimension of the top tape 14 on a cutting track of the cutting blade 18a. With this configuration, the chip-like electronic component 13 in a cavity 12 of the carrier tape 11 is brought into a state where its upper surface is restrained on the guide surface 19a of the component guide 19 when the top tape 14 is peeled from the carrier tape 11, and thus, the small chip-like electronic component 13 can be prevented from popping up, being changed in posture and being pinched. <P>COPYRIGHT: (C)2008,JPO&INPIT |
