发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method of capable of preventing liquid splash on a substrate surface owing to interference between a cleaning liquid and a drying gas and preventing re-adhesive of a liquid drop owing to the liquid splash on a dried portion of the substrate, in scanning a liquid discharge nozzle while discharging the cleaning liquid from the liquid discharge nozzle onto the substrate surface and scanning a gas jetting nozzle while jetting the drying gas from the gas jetting nozzle onto the substrate surface to dry the substrate during spin. SOLUTION: A discharge port of a pure water discharge nozzle 20 is scanned from a position opposite to the center of the substrate W to a position opposite to the circumferential edge of the substrate W while rotating the substrate W around a perpendicular axis with the substrate W held in a horizontal posture and discharging pure water from the pure water discharge nozzle 20 onto the substrate surface. In this case, a jetting port of the gas jetting nozzle 26 is scanned from a position opposite to the center of the substrate W to a position opposite to the circumferential edge of the substrate while jetting a nitrogen gas from the nozzle 26 onto the substrate surface so that the jetting port can be always positioned on the center of the substrate from the discharge port of the pure water discharge nozzle and be moved away from the discharge port of the pure water discharge nozzle. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008016781(A) 申请公布日期 2008.01.24
申请号 JP20060189362 申请日期 2006.07.10
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 HORI SHINPEI;SANADA MASAKAZU
分类号 H01L21/027;H01L21/304 主分类号 H01L21/027
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