POWER SEMICONDUCTOR APPARATUS

摘要

A power semiconductor apparatus is provided to improve an assembling characteristic and to enhance productivity by reducing the number of components. A resin package(21) is formed by mounting a power semiconductor element(12) and a control semiconductor element(13) on a main surface of a lead frame(11) and sealing the power and control semiconductor elements with a mold resin(20). A power terminal(16) is drawn from the resin package and is electrically connected to the power semiconductor element. A control terminal(17) is drawn from the resin package and is electrically connected to the control semiconductor element. A cylindrical case(22) is separable from the resin package to surround the resin package. The power terminal and the control terminal are drawn from lead insertion slots(23) formed in the case. A part of the power terminal is bent along an end face of the case.