| 摘要 |
Disclosed are various embodiments of electrical coupling apparatuses and methods. In one embodiment, an electrical coupling apparatus is provided having a first contact array on a card, where the first contact array is located at a first predefined position relative to an insertion edge of the card. The apparatus also includes a flexible printed circuit having a second contact array corresponding to the first contact array, where the second contact array is positioned in alignment with the first contact array. A compliant interposer material is positioned between the first and second contact arrays, the compliant interposer material electrically coupling respective pairs of contacts in the first and second contact arrays. Also, the insertion edge is configured to be inserted into a receptacle, the second contact array being positioned relative to the insertion edge so as to mate with a corresponding contact array in the receptacle when the insertion edge is inserted into the receptacle.
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