| 摘要 |
A thermal shutdown system that can accurately detect a chip overheat condition or a local overheat condition is described. This system can include a first shutdown circuit triggered by the chip overheat condition and a second shutdown circuit triggered by the local overheat condition. The second shutdown circuit can be located near the heat-generating component on the IC. The first shutdown circuit can be located in another area of the IC. A common temperature independent signal, which indicates whether a local overheat condition is anticipated, can enable one shutdown circuit and disable the other shutdown circuit. An enabled shutdown circuit can respond to a temperature sensitive signal to indicate a fault condition, i.e. a chip/local overheat condition.
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