发明名称 |
RGB light emitting diode package with improved color mixing properties |
摘要 |
An RGB light emitting diode package with improved color mixing properties includes red, green, and blue light emitting diode chips provided on a reflector. A photomixing material and a filler resin scatters rays so as to uniformly mix the rays emitted from the light emitting diode chips. The photomixing material and filler resin are applied onto upper sides of the light emitting diode chips while being mixed with each other, and the photomixing material is uniformly dispersed in the filler resin.
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申请公布号 |
US7321137(B2) |
申请公布日期 |
2008.01.22 |
申请号 |
US20040959154 |
申请日期 |
2004.10.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK YOUNG SAM;HAHM HUN JOO;KIM HYUNG SUK;PARK JUNG KYU;JEONG YOUNG JUNE |
分类号 |
H01L25/075;H01L33/32;H01L33/56 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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