CHUCK TABLE FOR SAWING MACHINE FOR MANUFACTURING SEMICONDUCTOR PACKAGES

摘要

A chuck table of a sawing apparatus for manufacturing a semiconductor package is provided to attach stably a strip on an upper surface of an absorbing table by deforming only a part of the absorbing table. A table base(10) has a top surface of an opening state and includes a vacuum pressure distribution groove(12) connected to a vacuum source. A supporting table(20) is coupled with the top surface. An absorbing table(30) is loaded on the supporting table and is connected with the vacuum pressure distribution groove. A plurality of absorbing holes(31) are formed at the absorbing table in order to form vacuum pressure. A strip is loaded on the top surface of the absorbing table. The absorbing table is loaded on a loading part(21) of the supporting table. One or more deformation parts(22) are formed on a lower surface of the loading part. A supporting part(23) having a plurality of connective holes is formed to connect the absorbing holes of the absorbing table with the vacuum pressure distribution groove of the table base.