发明名称 |
SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND ELECTRONIC APPLIANCE |
摘要 |
A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
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申请公布号 |
US2008012130(A1) |
申请公布日期 |
2008.01.17 |
申请号 |
US20070855391 |
申请日期 |
2007.09.14 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TANAKA SHUICHI;ITO HARUKI;ARUGA YASUHITO;TAMURA RYOHEI;TAKANO MICHIYOSHI |
分类号 |
G02F1/1345;H01L23/48;G09G3/00;H01L21/3205;H01L21/60;H01L23/52;H01L27/146;H01L29/40 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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