| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection jig which can reduce machining time or machining cost required for forming a mark on a wafer. SOLUTION: The substrate inspection jig 11 is used to inspect defect on a monitor wafer 3 by using an inspection device and a review device. A mark 13 is formed in a seat 12, and a fitting means 14 is provided to fit the seat 12 on the surface of the monitor wafer 3. The fitting means 14 is provided with a fitting member 16 which can be fitted to the outer periphery of the monitor wafer 3, and a bridge member 17 for connecting the fitting member 16 and the seat 12. When the fitting member 16 is fitted to the outer periphery of the monitor wafer 3, the seat 12 is arranged on the surface of the monitor wafer 3. COPYRIGHT: (C)2008,JPO&INPIT
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