<p>A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.</p>
申请公布号
WO2008008570(A2)
申请公布日期
2008.01.17
申请号
WO2007US69816
申请日期
2007.05.25
申请人
FORMFACTOR, INC.;ELDRIDGE, BENJAMIN, N.;MATHEWS, PETER B.;SHINDE, MAKARAND, S.;HOBBS, ERIC D.;HENSON, ROY, J.
发明人
ELDRIDGE, BENJAMIN, N.;MATHEWS, PETER B.;SHINDE, MAKARAND, S.;HOBBS, ERIC D.;HENSON, ROY, J.