| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inspecting method of a semiconductor device that does not damage a solder bump and does not damage wiring directly under an IC pad or an inter-layer insulating film. <P>SOLUTION: In this inspecting method, when the semiconductor device is manufactured by forming a bump in the IC pad of an IC chip 2 via a bump forming member 14 having a plurality of nozzles 12 for bump formation in a nozzle support plate 13, each nozzle 12 constituted by a conductive material is previously connected to a tester 61 via electrical wiring 62 for inspection, and the electrical characteristic of the IC chip is inspected by supplying an electric signal from the tester 61 to the gap between predetermined IC pads in the state where each IC pad is electrically connected to the nozzle 12 via the solder bump that is supplied to each nozzle 12 and melted by heating. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
