| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin film device where a resin film hardly peels off. <P>SOLUTION: In the thin film device 10, a conductive pattern 14A is provided on one principal surface of a planar substrate 18, and the conductive pattern is covered with the resin film 15B. This conductive pattern has a bottom 41 disposed on the principal surface of the substrate, an upper surface 42 that is opposed to the bottom 41 and is spaced out from the principal surface of the substrate, and two sides 43, 44 that connect the bottom with the upper surface. A recess is each provided at these sides and an insulating film is each extended inside the recesses. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
