发明名称 DEVICE FOR BONDING TWO PLATE-SHAPED OBJECTS
摘要 A method for bonding two plate-shaped objects ( 5 ) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects ( 5 ) with the adhesive in between are transported into a cure chamber ( 11 ) comprising an ultraviolet lamp ( 12 ) and a heating element ( 13 ). A movable heat-shielding member ( 3 ) is temporary present between the objects ( 5 ) and the heating element ( 13 ) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member ( 3 ) is positioned outside the cure chamber ( 11 ) during a part of the cure treatment.
申请公布号 US2008011427(A1) 申请公布日期 2008.01.17
申请号 US20070773149 申请日期 2007.07.03
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V. 发明人 MAAS HENRICUS G.R.;MICHIELSEN THEODORUS M.;WAELEN RICHARD J.M.
分类号 B29C65/02;C09J5/06 主分类号 B29C65/02
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