发明名称 PRESSURE-BONDING DEVICE AND TAPING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a taping apparatus capable of easily adjusting a degree of parallelism between a supporting board and a pressure-bonding head in a short time, performing a high-speed driving of the pressure-bonding head, and downsizing an actuator that drives the pressure-bonding head and the whole device. SOLUTION: The taping apparatus has a supporting board 5 that supports a career tape 4 for storing an electronic component, a pressure-bonding head 9 that pressure-bonds a cover tape 11 to the career tape on the supporting board, and a spherical-holding mechanism 20 that swingably supports the supporting board by a spherical seat 24 about a spherical center thereof. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008007173(A) 申请公布日期 2008.01.17
申请号 JP20060180551 申请日期 2006.06.30
申请人 APIC YAMADA CORP 发明人 TAKAHASHI KENICHI
分类号 B65B15/04 主分类号 B65B15/04
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