| 摘要 |
<p>An apparatus for forming a photoresist is provided to enhance a yield of a process of a semiconductor device and a reliability of a semiconductor device by reducing a process time and preventing a wafer from be damaged in transferring the wafer. An apparatus for forming a photoresist includes a coating unit and an oven unit. The coating unit coats the photoresist by a wafer(130) rotating method. The oven unit bakes the coated photoresist. The coating unit and the oven unit are coupled to be mounted in a chamber and perform coating and baking processes of the photoresist simultaneously. The coating unit has a spin chuck and a photoresist supply device. The spin chuck rotates the wafer. The oven unit has a hot plate(160), a hot wire(150), a vacuum intake(140), and a pin(170). The hot plate is placed on an upper part of the spin chuck. The hot wire and the vacuum intake are positioned inside the hot plate. The pin is placed inside the hot plate and lifts the wafer. Further, a diameter of the hot plate is less than that of the wafer as 0 to 20mm.</p> |
