| 摘要 |
PROBLEM TO BE SOLVED: To provide surface-treated copper foil for a printed wiring board, a COF (Chip On Film) and an FPC (Flexible Printed Circuit) in which the adhesion between copper foil and polyimide is improved, and which is easy to be etched while maintaining its oxidation resistance. SOLUTION: Regarding the surface-treated copper foil, a surface treatment layer composed of phosphorous-containing nickel-molybdenum or a surface treatment layer at least containing phosphorous-nickel-molybdenum is formed on at least either face in a copper layer. Alternatively, regarding the surface treated copper foil, a molybdenum or molybdenum alloy layer is formed on a phosphorous-containing nickel layer or nickel alloy layer formed on at least either face in a copper layer. COPYRIGHT: (C)2008,JPO&INPIT
|
