| 摘要 |
Provided are a semiconductor package having an advantage for stacking and a stack-type semiconductor package using the semiconductor package. In one embodiment, the semiconductor package includes a wing-type substrate comprising a first surface, a second surface opposite the first surface, a chip pad area, an external terminal area on the first surface and a stack-type terminal pad on the second surface, wherein the chip pad area is lower than the external terminal area; a semiconductor chip mounted on the wing-type substrate within the chip pad area, wherein the semiconductor chip is electrically connected to the wing-type substrate; a sealing part on the wing-type substrate, the sealing part sealing the semiconductor chip and the wing-type substrate; and a conductive connecting member on the external terminal area, wherein a height of the conductive connecting member is greater than a height of the wing-type substrate.
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